Design Features

Aluminum nitride heat sinks, also known as high thermal conductivity ceramic cooling pads, fully utilize the high thermal conductivity 

and electrical insulation properties of aluminum nitride (AlN) to provide an efficient heat dissipation solution for electronic devices.

High Thermal Conductivity

Aluminum nitride boasts a high thermal conductivity of up to 170 W/m·K, enabling it to rapidly absorb and conduct heat from heat 

sources such as semiconductor devices, effectively dissipating heat into the environment through the large surface area of the heat sink.

Excellent Electrical Insulation

With a breakdown strength of up to 17-19 KV/mm and low dielectric loss, aluminum nitride heat sinks provide excellent thermal 

management capabilities without compromising their electrical insulation.

Low Coefficient of Thermal Expansion

Its coefficient of thermal expansion is 3.2-3.4 × 10⁻⁶/ºC, close to that of silicon. This ensures excellent matching with semiconductor 

materials during temperature changes, reducing stress caused by differences in thermal expansion.

Good Thermal Stability

It can be used in oxygen-rich environments up to 1000°C and exhibits thermal shock stability up to 400°C, making it suitable for 

high-temperature operating environments.

Smooth Surface and Uniform Thickness

This contributes to improved thermal contact efficiency and reduced thermal resistance, thereby enhancing heat dissipation performance.

Application areas

Aluminum nitride heat sinks play a crucial role in many high-tech fields, especially in applications requiring efficient heat dissipation:

High-performance computing devices

such as servers and workstations, generate significant heat and require efficient heat dissipation to maintain stable and efficient operation.

Power semiconductors and power electronics

including inverters and drive systems for electric vehicles, require efficient thermal management to control the heat generated by 

power components.

LED lighting equipment 

generates considerable heat; using aluminum nitride heat sinks can extend LED lifespan and maintain luminous efficacy.

Electronic packaging

 Aluminum nitride heat sinks are also widely used in semiconductor packaging to help reduce heat buildup within the package, 

improving overall device performance and reliability.

Aluminum nitride (ANT) heat sinks play a crucial role in modern electronics manufacturing, particularly in high-temperature,

high-power applications, thanks to their superior thermal conductivity and electrical insulation. These heat sinks not only 

effectively improve equipment operating efficiency and stability but also significantly extend equipment lifespan through 

optimized thermal management. Their high performance and reliability make ANT heat sinks an ideal choice for heat dissipation 

in electronic devices, meeting the ever-increasing cooling demands of high-performance electronic equipment.

In the field of precision ceramic machining and customization, our company is committed to producing various high-performance 

ceramic components, including zirconia ceramics, silicon nitride, and aluminum nitride. These ceramic components possess excellent 

thermal stability, electrical insulation, high-temperature stability, and wear resistance, and are widely used in key fields such as aerospace, 

electronics, machinery, military, and automotive. Our products, with their superior performance and reliability, provide crucial support 

and assurance to our customers, helping them improve production efficiency and optimize product performance.