Design Features

High thermal conductivity and excellent heat dissipation performance:

With a thermal conductivity exceeding 170 W/m·K, far surpassing alumina, it can quickly dissipate heat, making it suitable for 

heat-sensitive operations such as laser processing and chip packaging.

Excellent electrical insulation: 

Maintains good insulation properties even at high temperatures, preventing leakage and making it suitable for high-voltage 

environments and electronic carrier platforms.

High strength and crack resistance: 

Compared to alumina ceramics, aluminum nitride has higher flexural strength and thermal shock resistance, resisting mechanical 

stress and thermal shock.

Good chemical stability: 

Resistant to acid and alkali corrosion, it does not react with processed materials, making it suitable for cleanrooms or high-purity 

environments.

Customizable structure: 

The surface can be processed with micropore arrays, vacuum tanks, positioning grooves, through holes, etc., according to process 

requirements.

High-temperature vacuum adsorption stability: 

Even under continuous operation in high-temperature environments, its adsorption performance remains stable, and it is not 

easily deformed or cracked due to thermal expansion.

Application areas

Semiconductor Manufacturing: 

Vacuum adsorption platforms used in wafer transport, photolithography, and inspection processes to ensure positional 

accuracy and thermal stability.

Laser Processing Equipment: 

Stabilizes and adsorbs laser-processed parts, providing rapid heat conduction to prevent material overheating and deformation.

Precision CNC Equipment: 

Used in CNC/micro/nano machining to clamp brittle, thin workpieces such as ceramic and glass sheets.

LED and Optoelectronics 

Industry: Used for fixing and cooling during the processing of sapphire and ceramic substrates.